Electronic Manufacturing
PCB board intelligent inspection line The high-precision semiconductor packaging intelligent production line Semiconductor panel AOI inspection
General Equipment Intelligent Manufacturing
The hydrogen fuel engine production line The variable speed gearbox assembly line Electric drive axle assembly line
New Energy
The hydrogen fuel cell stack automated assembly line The overall layout diagram of the intelligent visual inspection system for battery cells
Intelligent Warehousing
The AGV/ unmanned forklift hybrid logistics workshop The heavy-duty AGV intelligent logistics dispatching system
Electronic Manufacturing
Leveraging end-to-end large models to empower production lines with autonomous learning capabilities, enabling full-process high-precision automated operations. The equipment features stable and reliable repeated positioning, suitable for flexible production of multi-specification precision electronic products.
Porduct
Display Panels
Semiconductors
PCB
PCBA
Semiconductor panel AOI inspection
the AOI automated quality inspection scene of the clean production line for panels, equipped with multi-camera visual inspection equipment, can quickly complete the precise defect detection of panels, and rely on collaborative robots to achieve fully unmanned operation throughout the process.
Product Specifications
Detection cycle time: High-efficiency improvement of detection cycle time core configuration: multi-phase camera position · high-precision platform · high-performance wire horse module
Technical Highlights
Semiconductor-level accuracy: Meeting ultra-high precision requirements, accurately identifying minute defects. High-speed parallel detection: High-rhythm adaptation to large-scale, high-flow modern production
Application Value
control of core quality: Strict screening to ensure the appearance of core components meets requirements. Improvement of production yield: Integrated quality inspection at the front and back ends of the entire line, significantly enhancing production efficiency
The high-precision semiconductor packaging intelligent production line
relies on 3D structured light vision positioning to achieve micron-level precision processing, with collaborative robots for automated operations, improving yield, reducing labor, and realizing lean chip packaging production
Product Specifications
. Application scope: Supports packaging of wafers of various sizes and high-density PCB/PCBA boards, adapting to the demands of multiple types of chips.
Technical Highlights
Vision +AI guidance :3D structured light positioning is accurate, and the AI model independently optimizes the process to achieve "production line thinking"
Application Value
Quality improvement and efficiency enhancement: Yield rate is significantly increased, and delivery cycle is shortened; Cost reduction operation: Reduce reliance on manual labor and achieve lean management.
PCB board intelligent inspection line
PCB fully automatic intelligent inspection production line, equipped with automatic loading and unloading transmission mechanism and optical inspection equipment, realizes full-process automated and precise inspection of circuit boards
Product Specifications
Application scope: PCB board inspection, covering common defect types, defining industry high standards.
Technical Highlights
Multi-dimensional fusion detection system: integrating multi-spectral AOI, 3D structured light and industrial CT scanning technology, AI+ deep learning to identify hidden defects.
Application Value
Dual excellence in efficiency and cost: Full-line monitoring and defect interception avoid subsequent ineffective investment, significantly reducing quality costs.